Interferometric scattering for optical tomoslicing of transparent solids

Yuan Chai; Hong-Hua Fang; Zhen-Ze Li; Tian-Wei Wang; Shao-Feng Liu; Hong-Ren Chen; Shu-Chang Li; Xiao-Yan Li; Jia-Ming Lyu; Hong-Bo Sun

doi:10.1038/s41377-026-02344-z

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Interferometric scattering for optical tomoslicing of transparent solids

Original Articles

- Interferometric scattering for optical tomoslicing of transparent solids
- Light: Science & Applications Vol. 15, Issue 8, Pages: 2524-2533(2026)
- Affiliations：
  
  1.State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China
  2.Key Laboratory of Advanced Light Conversion Materials and Biophotonics, School of Chemistry and Life Resources, Renmin University of China, Beijing 100872, China
  3.Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Author bio：
  
  Hong-Hua Fang (hfang@ruc.edu.cn)
  Jia-Ming Lyu (20252758@bistu.edu.cn)
  Hong-Bo Sun (hbsun@tsinghua.edu.cn)
- Funds：
- DOI：10.1038/s41377-026-02344-z
  CLC：
- Received：06 January 2026，
  
  Revised：2026-04-16，
  
  Accepted：11 May 2026，
  
  Online First：30 June 2026，
  
  Published：31 August 2026
- Accepted：
Scan QR Code
Chai, Y. et al. Interferometric scattering for optical tomoslicing of transparent solids. Light: Science & Applications, 15, 2524-2533 (2026).
DOI：

Chai, Y. et al. Interferometric scattering for optical tomoslicing of transparent solids. Light: Science & Applications, 15, 2524-2533 (2026). DOI： 10.1038/s41377-026-02344-z.

摘要

Abstract

While light scattering is widely utilized in optical metrology and measurement

it has long been regarded as detrimental in laser-material processing. Here

we report an interferometric scattering effect that overturns this conventional view by resolving the six-decade challenge of axial resolution in optical manufacturing. This breakthrough elevates the axial resolution from micrometers

e.g.

~2 µm in transparent solids slicing

to the sub-10 nm level. The underlying mechanism involves the controlled sequential generation of nano-scatterers through interference between the incident laser and deliberately seeded scattering centers. Based on this phenomenon

we developed an interferometric scattering-based optical tomoslicing technology (

-SOT)

achieving kerf widths as narrow as 7 nm under an industrial standard efficiency of up to 400 mm

/s. This unprecedented axial resolution enables nearly lossless laser wafering from ingots—reducing mass loss from ~30% to below 1% — with transformative potential for manufacturing laser crystals

photovoltaics

and microelectronic chips.

关键词

Keywords

references

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