Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

Huagang Liu; Wenxiong Lin; Minghui Hong

doi:10.1038/s41377-021-00596-5

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Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

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- Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications
- Light: Science & Applications Vol. 10, Issue 9, Pages: 1607-1629(2021)
- Affiliations：
  
  1.Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, 117576, Singapore, Singapore
  2.Key Laboratory of Optoelectronic Materials Chemistry and Physics, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Fuzhou, 350002, China
- Author bio：
  
  Wenxiong Lin (wxlin@fjirsm.ac.cn)
  Minghui Hong (elehmh@nus.edu.sg)
- Funds：
- DOI：10.1038/s41377-021-00596-5
  CLC：
- Published：30 September 2021，
  
  Published Online：05 August 2021，
  
  Received：10 March 2021，
  
  Revised：10 June 2021，
  
  Accepted：12 July 2021
- Accepted：
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Liu H. G., Lin W. X. & Hong M. H. et al. Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications. Light: Science & Applications, 10, 1607-1629 (2021).
DOI：

Liu H. G., Lin W. X. & Hong M. H. et al. Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications. Light: Science & Applications, 10, 1607-1629 (2021). DOI： 10.1038/s41377-021-00596-5.

摘要

Abstract

Laser has been demonstrated to be a mature and versatile tool that presents great flexibility and applicability for the precision engineering of a wide range of materials over other established micromachining techniques. Past decades have witnessed its rapid development and extensive applications ranging from scientific researches to industrial manufacturing. Transparent hard materials remain several major technical challenges for conventional laser processing techniques due to their high hardness

great brittleness

and low optical absorption. A variety of hybrid laser processing technologies

such as laser-induced plasma-assisted ablation

laser-induced backside wet etching

and etching assisted laser micromachining

have been developed to overcome these barriers by introducing additional medium assistance or combining different process steps. This article reviews the basic principles and characteristics of these hybrid technologies. How these technologies are used to precisely process transparent hard materials and their recent advancements are introduced. These hybrid technologies show remarkable benefits in terms of efficiency

accuracy

and quality for the fabrication of microstructures and functional devices on the surface of or inside the transparent hard substrates

thus enabling widespread applications in the fields of microelectronics

bio-medicine

photonics

and microfluidics. A summary and outlook of the hybrid laser technologies are also highlighted.

关键词

Keywords

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