Thermal Utilization on Chip

Yaohao Zhang; Bo Lai; Fei Yu; Xuesong Li; Yue Yang; Wei Lü; Ke Jiang; Xiaojuan Sun; Dabing Li

doi:10.1038/s41377-026-02326-1

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Thermal Utilization on Chip

Original Articles

- Thermal Utilization on Chip
- Light: Science & Applications Vol. 15, Issue 8, Pages: 2871-2883(2026)
- Affiliations：
  
  1.State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China
  2.Key Laboratory of Advanced Structural Materials, Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science, Changchun University of Technology, Changchun, China
  3.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China
- Author bio：
  
  Wei Lü (lw771119@hotmail.com)
  Xiaojuan Sun (sunxj@ciomp.ac.cn)
  Dabing Li (lidb@ciomp.ac.cn)
- Funds：
- DOI：10.1038/s41377-026-02326-1
  CLC：
- Received：05 November 2025，
  
  Revised：2026-04-19，
  
  Accepted：20 April 2026，
  
  Online First：02 June 2026，
  
  Published：31 August 2026
- Accepted：
Scan QR Code
Zhang, Y. H. et al. Thermal Utilization on Chip. Light: Science & Applications, 15, 2871-2883 (2026).
DOI：

Zhang, Y. H. et al. Thermal Utilization on Chip. Light: Science & Applications, 15, 2871-2883 (2026). DOI： 10.1038/s41377-026-02326-1.

摘要

Abstract

The integration and miniaturization of chips lead to significant power consumption and heat accumulation. Typically

the energy consumption of cooling systems accounts for morn than 50% of the input energy. Current thermal management technologies do not offer solutions for on-chip thermal energy loss. Herein

we propose an on-chip integrated thermal recovery system

which can simultaneously achieve efficient heat dissipation. Present system on chips is based on hydrovoltaic generator technology

consisting of electrodes and gel. With the deep ultraviolet LED (236 nm) chip suffering from severe heat accumulation as a prototype

upon integration with the thermal recovery system

not only maintain the chip temperature below 40 ℃

but also converts waste heat into stored electrical energy

resulting in a 610.70% improvement in overall energy utilization efficiency. To demonstrate its general applicability in commercial CPU systems

we used the commercial Intel G3220 chip and as an example

by incorporating four HEG units

the temperature was reduced from 93 ℃ to below 60 ℃

effectively enhancing computational performance and extending the chip’s lifespan.

关键词

Keywords

references

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