Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Martin Schumann; Tiemo Bückmann; Nico Gruhler; Martin Wegener; Wolfram Pernice

doi:10.1038/lsa.2014.56

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Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Original Articles

- Hybrid 2D–3D optical devices for integrated optics by direct laser writing
- Hybrid 2D–3D optical devices for integrated optics by direct laser writing
- LSA 2014年3卷第3期
- Affiliations：
  
  1.Institute of Applied Physics and DFG-Center for Functional Nanostructures (CFN), Karlsruhe Institute of Technology (KIT), 76131 Karlsruhe, Germany
  2.Institute of Nanotechnology (INT), 76344 Eggenstein-Leopoldshafen, Germany
- Author bio：
  
  Dr W Pernice, Institute of Nanotechnology (INT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany Email: wolfram.pernice@kit.edu
- Funds：
- DOI：10.1038/lsa.2014.56
  中图分类号：
- 纸质出版日期：2014-09，
  
  网络出版日期：2014-06-06，
  
  收稿日期：2013-12-06，
  
  修回日期：2014-02-21，
  
  录用日期：2014-02-25
- Accepted：
Scan QR Code
Hybrid 2D–3D optical devices for integrated optics by direct laser writing[J]. LSA, 2014,3(3).

Schumann, M. et al. Hybrid 2D–3D optical devices for integrated optics by direct laser writing. Light: Science & Applications, 3, e175 (2014).
Hybrid 2D–3D optical devices for integrated optics by direct laser writing[J]. LSA, 2014,3(3). DOI： 10.1038/lsa.2014.56.

Schumann, M. et al. Hybrid 2D–3D optical devices for integrated optics by direct laser writing. Light: Science & Applications, 3, e175 (2014). DOI： 10.1038/lsa.2014.56.

摘要

Abstract

Integrated optical chips have already been established for application in optical communication. They also offer interesting future perspectives for integrated quantum optics on a chip. At present

however

they are mostly fabricated using essentially planar fabrication approaches like electron-beam lithography or UV optical lithography. Many further design options would arise if one had complete fabrication freedom in regard to the third dimension normal to the chip without having to give up the virtues and the know-how of existing planar fabrication technologies. As a step in this direction

we here use three-dimensional dip-in direct-laser-writing optical lithography to fabricate three-dimensional polymeric functional devices on pre-fabricated planar optical chips containing Si

waveguides as well as grating couplers made by standard electron-beam lithography. The first example is a polymeric dielectric rectangular-shaped waveguide which is connected to Si

waveguides and that is adiabatically twisted along its axis to achieve geometrical rotation of linear polarization on the chip. The rotator's broadband performance at around 1550 nm wavelength is verified by polarization-dependent grating couplers. Such polarization rotation on the optical chip cannot easily be achieved by other means. The second example is a whispering-gallery-mode optical resonator connected to Si

waveguides on the chip

via

polymeric waveguides. By mechanically connecting the latter to the disk

we can control the coupling to the resonator and

at the same time

guarantee mechanical stability of the three-dimensional architecture on the chip.

关键词

Keywords

direct laser writingintegrated opticsnanophotonic circuitspolarization conversion

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