1.State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
2.Daheng College, University of Chinese Academy of Sciences, Beijing 100049, China
Lei Liang (liangl@ciomp.ac.cn)
Yongyi Chen (chenyy@ciomp.ac.cn)
Yuxin Lei (leiyuxin@ciomp.ac.cn)
Lijun Wang (wanglj@ciomp.ac.cn)
收稿:2025-02-17,
修回:2025-08-26,
录用:2025-09-17,
网络出版:2025-12-05,
纸质出版:2025-12-31
Scan QR Code
Can Yu, Meng Zhang, Lei Liang, 等. Advancements in transfer printing techniques and their applications in photonic integrated circuits[J]. Light: Science & Applications, 2025,14(12):3902-3924.
Yu, C. et al. Advancements in transfer printing techniques and their applications in photonic integrated circuits. Light: Science & Applications, 14, 3902-3924 (2025).
Can Yu, Meng Zhang, Lei Liang, 等. Advancements in transfer printing techniques and their applications in photonic integrated circuits[J]. Light: Science & Applications, 2025,14(12):3902-3924. DOI: 10.1038/s41377-025-02064-w.
Yu, C. et al. Advancements in transfer printing techniques and their applications in photonic integrated circuits. Light: Science & Applications, 14, 3902-3924 (2025). DOI: 10.1038/s41377-025-02064-w.
Transfer printing is a powerful and versatile integration method that is attracting increasing attention as regards both scientific research and industrial manufacturing. The transfer printing technique utilizes the viscoelastic properties of a stamp to pick devices (ink) from a donor substrate and print them onto a target substrate
exploiting the competition between several interfacial adhesion forces. The overall yield can be improved through the introduction of external stimuli such as light
heat
solution
pressure
and magnetic fields during the transfer printing operation. This review summarizes different transfer printing methods based on their working principles and discusses their detailed applications in photonic integrated circuits
taking lasers
semiconductor optical amplifiers
photodetectors
and other optical electronic elements as examples. Hence
the feasibility and viability of transfer printing are illustrated. Additionally
future challenges and opportunities for innovative development are discussed.
Huang, Z. L. et al. Three-dimensional integrated stretchable electronics. Nat. Electron. 1 , 473–480 (2018)..
Aziz, S. et al. Fabrication of ZnSnO 3 based humidity sensor onto arbitrary substrates by micro-Nano scale transfer printing. Sens. Actuators A Phys. 246 , 1–8 (2016)..
Nam, J. et al. Transfer printed flexible and stretchable thin film solar cells using a water-soluble sacrificial layer. Adv. Energy Mater. 6 , 1601269 (2016)..
Kim, T. H. et al. Full-colour quantum dot displays fabricated by transfer printing. Nat. Photonics 5 , 176–182 (2011)..
Kim, D. H. et al. Ultrathin silicon circuits with strain-isolation layers and mesh layouts for high-performance electronics on fabric, vinyl, leather, and paper. Adv. Mater. 21 , 3703–3707 (2009)..
Kim, D. H. et al. Complementary lo gic gates and ring oscillators on plastic substrates by use of printed ribbons of single-crystalline silicon. IEEE Electron Device Lett. 29 , 73–76 (2008)..
Ahn, J. H. et al. Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials. Science 314 , 1754–1757 (2006)..
Park, S. I. et al. Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays. Science 325 , 977–981 (2009)..
Choi, J. H. et al. Whole device printing for full colour displays with organic light emitting diodes. Nanotechnology 17 , 2246–2249 (2006)..
Ko, H. C. et al. A hemispherical electronic eye camera based on compressible silicon optoelectronics. Nature 454 , 748–753 (2008)..
Jung, I. et al. Paraboloid electronic eye cameras using deformable arrays of photodetectors in hexagonal mesh layouts. Appl. Phys. Lett. 96 , 021110 (2010)..
Yoon, J. et al. Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs. Nat. Mater. 7 , 907–915 (2008)..
Baca, A. J. et al. Compact monocrystalline silicon solar modules with high voltage outputs and mechanically flexible designs. Energy Environ. Sci. 3 , 208–211 (2010)..
Wang, H. F. et al. Robust tattoo electrode prepared by paper-assisted water transfer printing for wearable health monitoring. IEEE Sens. J. 22 , 3817–3827 (2022)..
Herbert, R. et al. Recent advances in printing technologies of nanomaterials for implantable wireless systems in health monitoring and diagnosis. Adv. Healthc. Mater. 10 , 2100158 (2021)..
Gao, Y.J. et al. Flexible hybrid sensors for health monitoring: materials and mechanisms to render wearability. Adv. Mater. 32 , 1902133 (2020)..
Shou, W. et al. Low-cost manufacturing of bioresorbable conductors by evaporation–condensation-mediated laser printing and sintering of Zn nanoparticles. Adv. Mater. 29 , 1700172 (2017)..
Bian, J. et al. Laser transfer, printing, and assembly techniques for flexible electronics. Adv. Electron. Mater. 5 , 1800900 (2019)..
Carlson, A. et al. Transfer printing techniques for materials assembly and micro/nanodevice fabrication. Adv. Mater. 24 , 5284–5318 (2012)..
Feng, X. et al. Competing fracture in kinetically controlled transfer printing. Langmuir 23 , 12555–12560 (2007)..
Linghu, C. H. et al. Transfer printing techniques for flexible and stretchable inorganic electronics. npj Flex. Electron. 2 , 26 (2018)..
Meitl, M. A. et al. Transfer printing by kinetic control of adhesion to an elastomeric stamp. Nat. Mater. 5 , 33–38 (2006)..
Cho, S. et al.Adhesiveless transfer printing of ultrathin microscale semiconductor materials by controlling the bending radius of an elastomeric stamp. Langmuir 32 , 7951–7957 (2016)..
Sun, Y. G. & Rogers, J. A. Fabricating semiconductor nano/microwires and transfer printing ordered arrays of them onto plastic substrates. Nano Lett. 4 , 1953–1959 (2004)..
Li, Y. H., Zhang, F. L. & Wang, S. T. Regulatable interfacial adhesion between stamp and ink for transfer printing. Interdiscip. Mater. 3 , 29–53 (2024)..
Yan, Z. C. et al. Thermal release transfer printing for stretchable conformal bioelectronics. Adv. Sci. 4 , 1700251 (2017)..
Ishikawa, F. N. et al. Transparent electronics based on transfer printed aligned carbon nanotubes on rigid and flexible substrates. ACS Nano 3 , 73–79 (2009)..
Sim, K. et al. High fidelity tape transfer printing based on chemically induced adhesive strength modulation. Sci. Rep. 5 , 16133 (2015)..
Guo, C. et al. Large-scale programmable assembly of functional micro-components for advanced electronics via light-regulated adhesion and polymer growth. npj Flex. Electron. 6 , 4 4 (2022)..
Lanzalaco, S. et al. Recent advances in poly ( N -isopropylacrylamide) hydrogels and derivatives as promising materials for biomedical and engineering emerging applications. Adv. Eng. Mater. 25 , 2201303 (2023)..
Khabbaz Abkenar, S. et al. Transfer printing gold nanoparticle arrays by tuning the surface hydrophilicity of thermo-responsive poly N -isopropylacrylamide (PNIPAAm). Nanoscale 9 , 2969–2973 (2017)..
Liu, G. Y. et al. Graphene-assisted metal transfer printing for wafer-scale integration of metal electrodes and two-dimensional materials. Nat. Electron. 5 , 275–280 (2022)..
Zabow, G. Reflow transfer for conformal three-dimensional microprinting. Science 378 , 894–898 (2022)..
Chen, Z. J., Zhang, C. & Zheng, Z. J. Advancements in transfer printing techniques for flexible electronics: adjusting interfaces and promoting versatility. Int. J. Extrem. Manuf. 6 , 052005 (2024)..
Lee, C. H., Kim, D. R. & Zheng, X. L. Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method. Nano Lett. 11 , 3435–3439 (2011)..
Oh, K. et al. Water-mediated Al metal transfer printing with contact inking for fabrication of thin-film transistors. Small 5 , 558–561 (2009)..
Liu, H. J. et al. Controlled adhesion of ice—toward ultraclean 2D materials. Adv. Mater. 35 , 2210503 (2023)..
Wang, Y. B. et al. Bolometric effect in a waveguide-integrated graphene photodetector. Chin. Phys. B 25 , 118103 (2016)..
Wang, Y. B. et al. Photoconductive multi-layer graphene photodetectors fabricated on etched silicon-on-insulator substratesr. Chin. Phys. B 26 , 028101 (2017)..
Wang, Y. B. et al. The nonlinear electronic transport in multilayer graphene on silicon-on-insulator substrates. Chin. Phys. Lett. 34 , 067201 (2017)..
Zhuang, Q. N. et al. Wafer-patterned, permeable, and stretchable liquid metal microelectrodes for implantable bioelectronics with chronic biocompatibility. Sci. Adv. 9 , eadg8602 (2023)..
Liu, J. S. et al. Sacrificial layer-assisted nanoscale transfer printing. Microsyst. Nanoeng. 6 , 80 (2020)..
Saeidpourazar, R. et al. Laser-driven micro transfer placement of prefabricated microstructures. J. Microelectromech. Syst. 21 , 1049–1058 (2012)..
Gao, Y. Y. et al. An accurate thermomechanical model for laser-driven microtransfer printing. J. Appl. Mech. 84 , 064501 (2017)..
Eisenhaure,J. & Kim, S. Laser-driven shape memory effect for transfer printing combining parallelism with individual object control. Adv. Mater. Technol. 1 , 1600098 (2016)..
Zheng, N. et al. High strain epoxy shape memory polymer. Polym. Chem. 6 , 3046–3053 (2015)..
Mondal, S. Recent developments in temperature responsive shape memory polymers. Mini-Rev. Org. Chem. 6 , 114–119 (2009)..
Luo, H. Y. et al. Laser-driven programmable non-contact transfer printing of objects onto arbitrary receivers via an active elastomeric microstructured stamp. Natl. Sci. Rev. 7 , 296–304 (2020)..
Tian, Y. et al. Adhesion and friction in gecko toe attachment and detachment. Proc. Natl. Acad. Sci. USA 103 , 19320–19325 (2006)..
Yoo, B. et al. Elastomeric angled microflaps with reversible adhesion for transfer-printing semiconductor membranes onto dry surfaces. ACS Appl. Mater. Interfaces 6 , 19247–19253 (2014)..
Autumn, K. et al. Evidence for van der Waals adhesion in gecko setae. Proc. Natl. Acad. Sci. USA 99 , 12252–12256 (2002)..
Carlson, A. et al. Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly. Appl. Phys. Lett. 98 , 264104 (2011)..
Yang, S. Y. et al. Elastomer surfaces with directionally dependent adhesion strength and their use in transfer printing with continuous roll-to-roll applications. Adv. Mater. 24 , 2117–2122 (2012)..
Mengüç, Y. et al. Gecko-inspired controllable adhesive structures applied to micromanipulation. Adv. Funct. Mater. 22 , 1246–1254 (2012)..
Jeong, J. et al. Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays. J. R. Soc. Interface 11 , 20140627 (2014)..
Carlson, A. et al. Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing. Adv. Funct. Mater. 22 , 4476–4484 (2012)..
Kim, S. et al. Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. Proc. Natl. Acad. Sci. USA 107 , 17095–17100 (2010)..
Eisenhaure, J. D. et al. The use of shape memory polymers for microassembly by transfer printing. J. Microelectromech. Syst. 23 , 1012–1014 (2014)..
Linghu, C. H. et al. Rapidly tunable and highly reversible bio-inspired dry adhesion for transfer printing in air and a vacuum. Soft Matter 15 , 30–37 (2019)..
Wang, C. J. et al. Programmable and scalable transfer printing with high reliability and efficiency for flexible inorganic electronics. Sci. Adv. 6 , eabb2393 (2020)..
Zhang, S. et al. A thermal actuated switchable dry adhesive with high reversibility for transfer printing. Int. J. Extrem. Manuf. 3 , 035103 (2021)..
Kier, W. M. The structure and adhesive mechanism of octopus suckers. Integr. Comp. Biol. 42 , 1146–1153 (2002)..
Tramacere, F. et al. Unveiling the morphology of the acetabulum in octopus suckers and its role in attachment. Interface Focus 5 , 20140050 (2015)..
Lee, H. et al. Octopus-inspired smart adhesive pads for transfer printing of semiconducting nanomembranes. Adv. Mater. 28 , 7457–7465 (2016)..
Wang, S. H. et al. Elastic energy storage enabled magnetically actuated, octopus-inspired smart adhesive. Adv. Funct. Mater. 31 , 2009217 (2021)..
Liang, C. M. et al. Adhesion performance study of a novel microstructured stamp for micro-transfer printing. Soft Matter 17 , 4989–4997 (2021)..
Li, X. S. et al. Load sharing design of a multi-legged adaptable gripper with gecko-inspired controllable adhesion. IEEE Robot. Autom. Lett. 6 , 8482–8489 (2021)..
Haq, M. A., Su, Y. L. & Wang, D. J. Mechanical properties of PNIPAM based hydrogels: a review. Mater. Sci. Eng. C 70 , 842–855 (2017)..
Liu, X. et al. Liquid droplet stamp transfer printing. Adv. Funct. Mater. 31 , 2105407 (2021)..
Sim, K. et al. Three-dimensional curvy electronics created using conformal additive stamp printing. Nat. Electron. 2 , 471–47 9 (2019)..
Chen, X. Y. et al. Wrap-like transfer printing for three-dimensional curvy electronics. Sci. Adv. 9 , eadi0357 (2023)..
Linghu, C. H. et al. Universal SMP gripper with massive and selective capabilities for multiscaled, arbitrarily shaped objects. Sci. Adv. 6 , eaay5120 (2020)..
Li, H. C. et al. High-efficiency transfer printing using droplet stamps for robust hybrid integration of flexible devices. ACS Appl. Mater. Interfaces 13 , 1612–1619 (2021)..
Billet, M. et al. Recent progress in heterogeneous integration on the silicon nitride platform using micro-transfer printing. In Proc. SPIE 12891, Silicon Photonics XIX 128910B (SPIE, 2024).
Corbett, B. et al. Transfer print techniques for heterogeneous integration of photonic components. Prog. Quantum Electron. 52 , 1–17 (2017)..
Wuytens, P. C. et al. Gold nanodome-patterned microchips for intracellular surface-enhanced Raman spectroscopy. Analyst 140 , 8080–8087 (2015)..
Foster, M. A. et al. Silicon-chip-based ultrafast optical oscilloscope. Nature 456 , 81–84 (2008)..
Silverstone, J. W. et al. Silicon quantum photonics. IEEE J. Sel. Top. Quantum Electron. 22 , 390–402 (2016)..
Bernabé, S. et al. Silicon photonics for terabit/s communication in data centers and exascale computers. Solid-State Electron. 179 , 107928 (2021)..
Shi, Y. C. et al. Silicon photonics for high-capacity data communications. Photonics Res. 10 , A106–A134 (2022)..
Doerr, C. & Chen, L. Silicon photonics in optical coherent systems. Proc. IEEE 106 , 2291–2301 (2018)..
Li, Q. & Lau, K. M. Epitaxial growth of highly mismatched Ⅲ–Ⅴ materials on (001) silicon for electronics and optoelectronics. Prog. Cryst. Growth Charact. Mater. 63 , 105–120 (2017)..
Roelkens, G. et al. Present and future of micro-transfer printing for heterogeneous photonic integrated circuits. APL Photonics 9 , 010901 (2024)..
Liang, D. et al. Hybrid integrated platforms for silicon photonics. Materials 3 , 1782–1802 (2010)..
Hu, Y. T., Liang, D. & Beausoleil, R. G. An advanced Ⅲ–Ⅴ-on-silicon photonic integration platform. Opto-Electron. Adv. 4 , 200094 (2021)..
Zhang, J. et al. Ⅲ–Ⅴ-on-Si photonic integrated circuits realized using micro-transfer-printing. APL Photonics 4 , 110803 (2019)..
Soltanian, E. et al. Micro-transfer-printed narrow-linewidth Ⅲ–Ⅴ-on-Si double laser structure with a combined 110 nm tuning range. Opt. Express 30 , 39329–39339 (2022)..
Pan, B. W. et al. Ⅲ–Ⅴ-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing. In 2023 Optical Fiber Communications Conference and Exhibition (OFC) 1–3 (IEEE, 2023).
Morito, K. et al. High-output-power polarization-insensitive semiconductor optical amplifier. J. Lightwave Technol. 21 , 176–181 (2003)..
Asghari, M., White, I. H. & Penty, R. V. Wavelength conversion using semiconductor optical amplifiers. J. Lightwave Technol. 15 , 1181–1190 (1997)..
Haq, B. et al. Micro-transfer-printed Ⅲ–Ⅴ-on-silicon C-band SOAs with 17 dB Gain. In IEEE Photonics Conference (IPC) 1–2 (IEEE, 2019).
Haq, B. et al. Micro-transfer-printed Ⅲ–Ⅴ-on-silicon C-band semiconductor optical amplifiers. Laser Photonics Rev. 14 , 1900364 (2020)..
Soltanian, E. et al. Micro-transfer-printed Ⅲ–Ⅴ-on-Si semiconductor optical amplifier with 15 dBm output saturation power. In 2023 IEEE Silicon Photonics Conference (SiPhotonics) 1–2 (IEEE, 2023).
Op de Beeck, C. et al. Heterogeneous Ⅲ–Ⅴ on silicon nitride amplifiers and lasers via microtransfer printing. Optica 7 , 386–393 (2020)..
Deng, H. et al. Wavelength converter using micro transfer-printed optical amplifiers on a full SiPh platform. In 2023 IEEE Silicon Photonics Conference (SiPhotonics) 1–2 (IEEE, 2023).
Zhang, J. et al. Micro-transfer printing InPC-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters. Opt. Express 31 , 42807–42821 (2023)..
Justice, J. et al. Wafer-scale integration of group Ⅲ–Ⅴ lasers on silicon using transfer printing of epitaxial layers. Nat. Photonics 6 , 610–614 (2012)..
Yang, H. J. et al. Transfer-printed stacked nanomembrane lasers on silicon. Nat. Photonics 6 , 615–620 (2012)..
Kelsall, R. W. Rubber stamp for silicon photonics. Nat. Photonics 6 , 577–579 (2012)..
Zhang, J. et al. Transfer-printing-based integration of a Ⅲ–Ⅴ-on-silicon distributed feedback laser. Opt. Express 26 , 8821–8830 (2018)..
Zhang, J. et al. Ⅲ–Ⅴ-on-Si DFB laser with co-integrated power amplifier realized using micro-transfer printing. IEEE Photonics Technol. Lett. 35 , 593–596 (2023)..
Loi, R. et al. Edge-coupling of O-band InP etched-facet lasers to polymer waveguides on SOI by micro-transfer-printing. IEEE J. Quantum Electron. 56 , 6400108 (2020)..
Uzun, A. et al. Integration of edge-emitting quantum dot lasers with different waveguide platforms using micro-transfer printing. IEEE J. Sel. Top. Quantum Electron. 29 , 1500210 (2023)..
Goyvaerts, J. et al. Enabling VCSEL-on-silicon nitride photonic integrated circuits with micro-transfer-printing. Optica 8 , 1573–1580 (2021)..
Blumenthal, D. J. et al. Silicon nitride in silicon photonics. Proc. IEEE 106 , 2209–2231 (2018)..
Sang, L. W., Liao, M. Y. & Sumiya, M. A comprehensive review of semiconductor ultraviolet photodetectors: from thin film to one-dimensional nanostructures. Sensors 13 , 10482–10518 (2013)..
Downs, C. & Vandervelde, T. E. Progress in infrared photodetectors since 2000. Sensors 13 , 5054–5098 (2013)..
Zumeit, A. et al. Printed GaAs microstructures-based flexible high-performance broadband photodetectors. Adv. Mater. Technol. 7 , 2200772 (2022)..
Muthuganesan, H. et al. 100 Gbps PAM4 ultra-thin photodetectors integrated on SOI platform by micro transfer printing. Opt. Express 31 , 36273–36280 (2023)..
De Groote, A. et al. Transfer-printing-based integration of single-mode waveguide-coupled Ⅲ–Ⅴ-on-silicon broadband light emitters. Opt. Express 24 , 13754–13762 (2016)..
Qin, S. B. et al. Micro-transfer printing of O-band InP-InGaAs photodiodes on a silicon nitride photonic platform. In 2024 IEEE Silicon Photonics Conference (SiPhotonics) 1–2 (IEEE, 2024).
Trajkovic, M. et al. Increasing the speed of an InP-based integration platfor m by introducing high speed electroabsorption modulators. IEEE J. Sel. Top. Quantum Electron. 25 , 3400208 (2019)..
Fu, X. et al. 5 x 20 Gb/s heterogeneously integrated Ⅲ–Ⅴ on silicon electro-absorption modulator array with arrayed waveguide grating multiplexer. Opt. Express 23 , 18686–18693 (2015)..
Doerr, C. R. et al. Compact high-speed InP DQPSK modulator. IEEE Photonics Technol. Lett. 19 , 1184–1186 (2007)..
Melikyan, A. et al. Differential drive I/Q modulator based on silicon photonic electro-absorption modulators. J. Lightwave Technol. 38 , 2872–2876 (2020)..
Moynihan, O. et al. Micro-transfer printed high-speed InP-based electro-absorption modulator on silicon-on-insulator. Appl. Phys. Lett. 125 , 051102 (2024)..
Roelkens, G. et al. Micro-transfer printing for heterogeneous Siphotonic integrated circuits. IEEE J. Sel. Top. Quantum Electron. 29 , 8200414 (2023)..
Vanackere, T. et al. Heterogeneous integration of a high-speed lithium niobate modulator on silicon nitride using micro-transfer printing. APL Photonics 8 , 086102 (2023)..
Tan, Y. et al. Micro-transfer printed thin film lithium niobate (TFLN)-on-silicon ring modulator. ACS Photonics 11 , 1920–1927 (2024)..
Niels, M. et al. Centimetre-scale micro-transfer printing to enable heterogeneous integration of thin film lithium niobate with silicon photonics. Opt. Mater. Express 15 , 531–540 (2025)..
Su, J. W. et al. Large-area microtransfer-printed thin-film lithium niobate-silicon nitride microring optical filter with nanosecond tuning speed. ACS Photonics 12 , 2062–2069 (2025)..
Su, J. W. et al. Narrowband fast-tunable microring filter based on micro-transfer printed thin-film lithium niobate on silicon nitride. In 2024 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC) 1–4 (IEEE, 2024).
Palici, A. M. et al. Heterogeneous integration of li thium niobate and silicon photonics for nonlinear optics. In CLEO: Applications and Technology 2024 AW4H. 1 (Optica Publishing Group, 2024).
Li, Z. B. et al. Photonic integration of lithium niobate micro-ring resonators onto silicon nitride waveguide chips by transfer-printing. Opt. Mater. Express 12 , 4375–4383 (2022)..
Zhang, J. et al. Lossless high-speed silicon photonic MZI switch with a micro-transfer-printed Ⅲ–Ⅴ amplifier. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 441–445 (IEEE, 2022).
Su, J. W. et al. Broadband and low-crosstalk 2×2 electro-optic switch via micro-transfer printing TFLN on Si 3 N 4 . In Optical Fiber Communication Conference (OFC) 2025 W3F. 2 (Optica Publishing Group, 2025)..
Bower, C. A., Meitl, M. & Kneeburg, D. Micro-transfer-printing: heterogeneous integration of microscale semiconductor devices using elastomer stamps. In IEEE SENSORS 2111–2113 (IEEE, 2014).
Karabchevsky, A. Ultra-broadband spectrometer on a chip of picometer scale resolution. Light Sci. Appl. 12 , 235 (202 3)..
Yao, C. H. et al. Broadband picometer-scaleresolution on-chip spectrometer with reconfigurable photonics. Light Sci. Appl. 12 , 156 (2023)..
Vitali, V. et al. Nonlinear signal processing on chip. in On-Chip Photonics (eds Karabchevsky, A. & Choudhary, A. ) 273–296 (Elsevier, 2024).
Song, D. et al. High-resolution transfer printing of graphene lines for fully printed, flexible electronics. ACS Nano 11 , 7431–7439 (2017)..
Wang, Q. G. et al. Tape nanolithography:a rapid and simple method for fabricating flexible, wearable nanophotonic devices. Microsyst. Nanoeng. 4 , 31 (2018)..
Metcalf, D. et al. Wearables and the Internet of Things for health: wearable, interconnected devices promise more efficient and comprehensive health care. IEEE Pulse 7 , 35–39 (2016)..
Shi, Q. F. et al. Progress in wearable electronics/photonics—moving toward the era of artificial intelligence and internet of things. InfoMat 2 , 1131–1162 (2020)..
Zeng, W. et al. Fiber-based wearable electronics: a review of materials, fabrication, devices, and applications. Adv. Mater. 26 , 5310–5336 (2014)..
Karabchevsky, A. et al. On-chip nanophotonics and future challenges. Nanophotonics 9 , 3733–3753 (2020)..
0
浏览量
0
Downloads
0
CSCD
关联资源
相关文章
相关作者
相关机构
京公网安备11010802024621