1.School of Electronic and Optical Engineering, Nanjing University of Science and Technology, Nanjing, Jiangsu Province 210094, China
2.The 13th Research Institute of China Electronics Technology Group Corporation, Shijiazhuang, Hebei Province 050052, China
Qun Yuan (karmen86913@gmail.com)
Zhishan Gao (zhishgao@njust.edu.cn)
收稿:2025-09-23,
修回:2026-01-01,
录用:2026-01-09,
网络首发:2026-01-29,
纸质出版:2026-03-31
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Yin Li, Qun Yuan, Xiao Huo, 等. Fourier ptychographic coherence scanning interferometry for 3D morphology of high aspect ratio and composite micro-trenches[J]. Light: Science & Applications, 2026,15(3):1037-1050.
Li, Y. et al. Fourier ptychographic coherence scanning interferometry for 3D morphology of high aspect ratio and composite micro-trenches. Light: Science & Applications, 15, 1037-1050 (2026).
Yin Li, Qun Yuan, Xiao Huo, 等. Fourier ptychographic coherence scanning interferometry for 3D morphology of high aspect ratio and composite micro-trenches[J]. Light: Science & Applications, 2026,15(3):1037-1050. DOI: 10.1038/s41377-026-02189-6.
Li, Y. et al. Fourier ptychographic coherence scanning interferometry for 3D morphology of high aspect ratio and composite micro-trenches. Light: Science & Applications, 15, 1037-1050 (2026). DOI: 10.1038/s41377-026-02189-6.
Non-destructive and accurate characterization of high aspect ratio (HAR) and composite micro-trenches is critical for advanced microfabrication but remains a major challenge. Conventional coherence scanning interferometry (CSI)
while widely adopted
suffers from low signal-to-noise ratio (SNR) and limited lateral resolution when applied to HAR and composite microstructures. Here
we present Fourier ptychographic coherence scanning interferometry (FP-CSI)
the first transmissive CSI modality that integrates the aperture synthesis strategy of Fourier ptychographic microscopy with the quantitative phase-resolved capability of interferometry. FP-CSI enables robust three-dimensional morphology reconstruction with enhanced SNR and improved lateral resolution
without reliance on iterative phase retrieval. We demonstrate accurate measurements of a HAR micro-trench (300 μm depth
30:1 aspect ratio) and micro-electro-mechanical system (MEMS) devices (aspect ratios 6:1–20:1). FP-CSI achieves lateral resolution up to the incoherent diffraction limit and maintains this performance even at trench bottoms. Owing to its fidelity
robustness
and non-destructive operation
FP-CSI provides a powerful new metrology platform for next-generation semiconductor inspection
precision manufacturing
and emerging micro-optoelectronic systems.
Zhou, S. J. et al. GaN-based flip-chip LEDs with highly reflective ITO/DBR p-type and via hole-based n-type contacts for enhanced current spreading and light extraction. Opt. Laser Technol. 92 , 95–100 (2017)..
Takayama, O. et al. Midinfrared surface waves on a high aspect ratio nanotrench platform. ACS Photonics 4 , 2899–2907 (2017)..
Dowling, K. M., Ransom, E. H. & Senesky, D. G. Profile evolution of high aspect ratio silicon carbide trenches by inductive coupled plasma etching. J. Microelectromech. Syst. 26 , 135–142 (2017)..
Yoon, M. Y. et al. Plasma etching of the trench pattern with high aspect ratio mask under ion tilting. Appl. Surf. Sci. 595 , 153462 (2022)..
Horikiri, F. et al. Excellent potential of photo-electrochemical etching for fabricating high-aspect-ratio deep trenches in gallium nitride. Appl. Phys. Express 11 , 091001 (2018)..
Bronnikov, K. et al. Uniform subwavelength high-aspect ratio nanogratings on metal-protected bulk silicon produced by laser-induced periodic surface structuring. Appl. Phys. Lett. 119 , 211106 (2021)..
Hui, D. T. et al. A MEMS grating modulator with a tunable sinusoidal grating for large-scale extendable apertures. Microsyst. Nanoeng. 11 , 39 (2025)..
Sun, W. et al. High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features. J. Micro/Nanolithogr. MEMS MOEMS 19 , 024002 (2020)..
Humood, M. et al. Fabrication and mechanical cycling of polymer microscale architectures for 3D MEMS sensors. Adv. Eng. Mater. 21 , 1801254 (2019)..
Hovell, T. et al. Measurement techniques for three-dimensional metrology of high aspect ratio internal features—a review. Metrology 3 , 139–168 (2023)..
Wang, Z. Z. et al. Adjustable low NA quasi-confocal reflectometry for ultra-high-aspect-ratio micro-structures. Opt. Laser Technol. 176 , 110980 (2024)..
Li, X. J., Sui, X. Q. & Kuang, D. F. Fast and accurate measurement of high aspect ratio MEMS trench array with optical lattice illumination. Microsyst. Nanoeng. 11 , 165 (2025)..
Chein, W. H. et al. Non-integral depth measurement of high-aspect-ratio multi-layer microstructures using numerical-aperture shaped beams. Opt. Lasers Eng. 166 , 107563 (2023)..
Ku, Y. S., Huang, K. C. & Hsu, W. Characterization of high density through silicon vias with spectral reflectometry. Opt. Express 19 , 5993–6006 (2011)..
Ferreras Paz, V. et al. Solving the inverse grating problem bywhite light interference fourier scatterometry. Light Sci. Appl. 1 , e36 (2012)..
Li, G. N. et al. MEMS high aspect ratio trench three-dimensional measurement using through-focus scanning optical microscopy and deep learning method . Appl. Sci. 12 , 8396 (2022)..
Attota, R. K. et al. Feasibility study on 3-D shape analysis of high-aspect-ratio features using through-focus scanning optical microscopy. Opt. Express 24 , 16574–16585 (2016)..
Grasland, J. et al. Sensitivity analysis of optical scatterometry technique for high aspect ratio trench measurement. In Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII 57–68 (SPIE, San Jose, 2023).
Chein, W. H. et al. Non-integral model-based scatterometry for CD metrology of single high-aspect-ratio microstructures. Surf. Topogr. Metrol. Prop. 11 , 024004 (2023)..
Iff, W. A. et al. Electromagnetic analysis for optical coherence tomography based through silicon vias metrology. Appl. Opt. 58 , 7472–7488 (2019)..
Ma, J. Q. et al. Three-dimensional topography of high-aspect ratio trenches by sample-induced aberration-compensable coherence scanning interferometry. ACS Photonics 11 , 1068–1077 (2024)..
Qiao, W. Y. et al. Research on the modulation aberration numerical correction method of interference signals for high aspect ratio samples utilizing coherence scanning interferometry. Opt. Express 33 , 330–343 (2025)..
Ma, J. Q. et al. Topography reconstruction of high aspect ratio silicon trench array via near-infrared coherence scanning interferometry. Opt. Express 32 , 22493–22507 (2024)..
de Groot, P. & Deck, L. Surface profiling by analysis of white-light interferograms in the spatial frequency domain. J. Mod. Opt. 42 , 389–401 (1995)..
Jo, T., Kim, S. & Pahk, H. 3D measurement of TSVs using low numerical aperture white-light scanning interferometry. J. Opt. Soc. Korea 17 , 317–322 (2013)..
Zheng, G. A., Horstmeyer, R. & Yang, C. H. Wide-field, high-resolution Fourier ptychographic microscopy. Nat. Photonics 7 , 739–745 (2013)..
Lee, B. et al. Single-shot phase retrieval via Fourier ptychographic microscopy. Optica 5 , 976–983 (2018)..
Wu, X. J. et al. Lens-free on-chip 3D microscopy based on wavelength-scanning fourier ptychographic diffraction tomography. Light Sci. Appl. 13 , 237 (2024)..
Ou, X. Z., Zheng, G. A. & Yang, C. H. Embedded pupil function recovery for Fourier ptychographic microscopy. Opt. Express 22 , 4960–4972 (2014)..
Zhang, S. H. et al. FPM-WSI: Fourier ptychographic whole slide imaging via feature-domain backdiffraction. Optica 11 , 634–646 (2024)..
Sun, J. S. et al. Resolution-enhanced Fourier ptychographic microscopy based on high-numerical-aperture illuminations. Sci. Rep. 7 , 1187 (2017)..
Liang, M. S. & Yang, C. Implementation of free-space Fourier ptychography with near maximum system numerical aperture. Opt. Express 30 , 20321–20332 (2022)..
Jin, Y. et al. Boundary-artifact-free quantitative phase imaging with Fourier ptychographic microscopy. Opt. Lett. 50 , 257–260 (2025)..
Zhou, A. et al. Fast and robust misalignment correction of Fourier ptychographic microscopy for full field of view reconstruction. Opt. Express 26 , 23661–23674 (2018)..
Chaumet, P. C. et al. Quantitative phase microscopies: accuracy comparison. Light Sci. Appl. 13 , 288 (2024)..
Cao, R. Z., Shen, C. & Yang, C. High-resolution, large field-of-view label-free imaging via aberration-corrected, closed-form complex field reconstruction. Nat. Commun. 15 , 4713 (2024)..
Ma, Q., Zhao, J. F. & Cui, G. M. Optimization of the FPM iterative process based on bright-field spectral overlap rate analysis. Opt. Lett. 49 , 5244–5247 (2024)..
Li, Z. S. et al. Fourier holo-ptychographic microscopy: a hybrid digital holography-Fourier ptychography approach to synthetic-aperture quantitative phase microscopy. ACS Photonics 12 , 2965–2971 (2025)..
Dong, S. Y. et al. Aperture-scanning Fourier ptychography for 3D refocusing and super-resolution macroscopic imaging. Opt. Express 22 , 13586–13599 (2014)..
Ou, X. Z. et al. Aperture scanning Fourier ptychographic microscopy. Biomed. Opt. Express 7 , 3140–3150 (2016)..
Sun, Y. F. et al. Surface topography measure ment of microstructures near the lateral resolution limit via coherence scanning interferometry. Opt. Lasers Eng. 152 , 106949 (2022)..
de Groot, P. Principles of interference microscopy for the measurement of surface topography. Adv. Opt. Photonics 7 , 1–65 (2015)..
International Organization for Standardization. Geometrical Product Specifications (GPS) – Surface Texture: Areal – Part 700: Calibration, Adjustment and Verification of Areal Topography Measuring Instruments (ISO 25178-700: 2022) (ISO, Geneva, 2022).
Kuang, C. F. et al. Digital micromirror device-based laser-illumination Fourier ptychographic microscopy. Opt. Express 23 , 26999–27010 (2015)..
Sun, J. S. et al. High-speed Fourier ptychographic microscopy based on programmable annular illuminations. Sci. Rep. 8 , 7669 (2018)..
Tian, L. et al. Computational illumination for high-speed in vitro Fourier ptychographic microscopy. Optica 2 , 904–911 (2015)..
Roy, M. et al. White-light interference microscopy: effects of multiple reflections within a surface film. Opt. Express 13 , 164–170 (2005)..
Xu, L. X., Chen, C. & Su, R. Error source sensitivity analysis in model-based coherence scanning interferometry for thin-film metrology. Appl. Opt. 64 , 4747–4757 (2025)..
de Groot, P. & Colonna de Lega, X. Signal modeling for low-coherence height-scanning interference microscopy. Appl. Opt. 43 , 4821–4830 (2004)..
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