Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Matthias Blaicher; Muhammad Rodlin Billah; Juned Kemal; Tobias Hoose; Pablo Marin-Palomo; Andreas Hofmann; Yasar Kutuvantavida; Clemens Kieninger; Philipp-Immanuel Dietrich; Matthias Lauermann; Stefan Wolf; Ute Troppenz; Martin Moehrle; Florian Merget; Sebastian Skacel; Jeremy Witzens; Sebastian Randel; Wolfgang Freude; Christian Koos

doi:10.1038/s41377-020-0272-5

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Original Articles

- Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
- Light: Science & Applications Vol. 9, Issue 3, Pages: 719-729(2020)
- Affiliations：
  
  1.Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstraße 5, 76131 Karlsruhe, Germany
  2.Institute for Microstructure Technology (IMT), KIT, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
  3.Institute for Automation and Applied Informatics (IAI), KIT, Hermann-von-Helmholtz-Platz 1, 76344 EggensteinLeopoldshafen, Germany
  4.Vanguard Automation GmbH, Gablonzer Straße 10, 76185 Karlsruhe, Germany
  5.Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute (HHI), Einsteinufer 37, 10587 Berlin, Germany
  6.Institute of Integrated Photonics (IPH), RWTH Aachen, Sommerfeldstraße 18/24, 52074 Aachen, Germany
- Author bio：
  
  Christian Koos (christian.koos@kit.edu)
- Funds：
- DOI：10.1038/s41377-020-0272-5
  CLC：
- Published：2020，
  
  Published Online：27 April 2020，
  
  Received：23 August 2019，
  
  Revised：09 February 2020，
  
  Accepted：23 February 2020
- Accepted：
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Matthias, B. et al. Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography. Light: Science & Applications, 9, 719-729 (2020).
DOI：

Matthias, B. et al. Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography. Light: Science & Applications, 9, 719-729 (2020). DOI： 10.1038/s41377-020-0272-5.

摘要

Abstract

Three-dimensional (3D) nano-printing of freeform optical waveguides

also referred to as photonic wire bonding

allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage

the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips

thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However

while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments

it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper

we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment

we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter

operating at a net data rate of 732.7 Gbit/s – a record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips

we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB

and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

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