
1.Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109, USA
2.Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA
Zetian Mi (ztmi@umich.edu)
Published:31 October 2022,
Published Online:10 October 2022,
Received:20 June 2022,
Revised:16 September 2022,
Accepted:19 September 2022
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Wu, Y. P. et al. InGaN micro-light-emitting diodes monolithically grown on Si: achieving ultra-stable operation through polarization and strain engineering. Light: Science & Applications, 11, 2540-2548 (2022).
Wu, Y. P. et al. InGaN micro-light-emitting diodes monolithically grown on Si: achieving ultra-stable operation through polarization and strain engineering. Light: Science & Applications, 11, 2540-2548 (2022). DOI: 10.1038/s41377-022-00985-4.
Micro or submicron scale light-emitting diodes (µLEDs) have been extensively studied recently as the next-generation display technology. It is desired that µLEDs exhibit high stability and efficiency
submicron pixel size
and potential monolithic integration with Si-based complementary metal-oxide-semiconductor (CMOS) electronics. Achieving such µLEDs
however
has remained a daunting challenge. The polar nature of Ⅲ-nitrides causes severe wavelength/color instability with varying carrier concentrations in the active region. The etching-induced surface damages and poor material quality of high indium composition InGaN quantum wells (QWs) severely deteriorate the performance of µLEDs
particularly those emitting in the green/red wavelength. Here we report
for the first time
µLEDs grown directly on Si with submicron lateral dimensions. The µLEDs feature ultra-stable
bright green emission with negligible quantum-confined Stark effect (QCSE). Detailed elemental mapping and numerical calculations show that the QCSE is screened by introducing polarization doping in the active region
which consists of InGaN/AlGaN QWs surrounded by an AlGaN/GaN shell with a negative Al composition gradient along the
c
-axis. In comparison with conventional GaN barriers
AlGaN barriers are shown to effectively compensate for the tensile strain within the active region
which significantly reduces the strain distribution and results in enhanced indium incorporation without compromising the material quality. This study provides new insights and a viable path for the design
fabrication
and integration of high-performance µLEDs on Si for a broad range of applications in on-chip optical communication and emerging augmented reality/mixed reality devices
and so on.
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