
Institute of Laser Engineering, Osaka University 2-6 Yamadaoka, Suita, Osaka, 565-0871, Japan
Masayoshi Tonouchi (tonouchi.masayoshi.ile@osaka-u.ac.jp)
Published:31 December 2022,
Published Online:25 November 2022,
Received:13 July 2022,
Revised:25 October 2022,
Accepted:06 November 2022
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Yang, D. X. et al. Rapid, noncontact, sensitive, and semiquantitative characterization of buffered hydrogen-fluoride-treated silicon wafer surfaces by terahertz emission spectroscopy. Light: Science & Applications, 11, 2982-2993 (2022).
Yang, D. X. et al. Rapid, noncontact, sensitive, and semiquantitative characterization of buffered hydrogen-fluoride-treated silicon wafer surfaces by terahertz emission spectroscopy. Light: Science & Applications, 11, 2982-2993 (2022). DOI: 10.1038/s41377-022-01033-x.
Advances in modern semiconductor integrated circuits have always demanded faster and more sensitive analytical methods on a large-scale wafer. The surface of wafers is fundamentally essential to start building circuits
and quantitative measures of the surface potential
defects
contamination
passivation quality
and uniformity are subject to inspection. The present study provides a new approach to access those by means of terahertz (THz) emission spectroscopy. Upon femtosecond laser illumination
THz radiation
which is sensitive to the surface electric fields of the wafer
is generated. Here
we systematically research the THz emission properties of silicon surfaces under different surface conditions
such as the initial surface with a native oxide layer
a fluorine-terminated surface
and a hydrogen-terminated surface. Meanwhile
a strong doping concentration dependence of the THz emission amplitude from the silicon surface has been revealed in different surface conditions
which implies a semiquantitative connection between the THz emission and the surface band bending with the surface dipoles. Laser-induced THz emission spectroscopy is a promising method for evaluating local surface properties on a wafer scale.
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