1.Department of Chemistry, Molecular Sciences Research Hub, Imperial College London, White City, London W12 0BZ, UK
2.Department of Electronics and Electrical Engineering, Indian Institute of Technology Guwahati, Guwahati 781039, India
3.The Blackett Laboratory, Department of Physics, Imperial College London, London SW7 2AZ, UK
4.Thomas Young Centre for Theory and Simulation of Materials, Imperial College London, London SW7 2AZ, UK
Debabrata Sikdar (deb.sikdar@iitg.ac.in)
John B. Pendry (j.pendry@imperial.ac.uk)
Alexei A. Kornyshev (a.kornyshev@imperial.ac.uk)
纸质出版日期:2020,
网络出版日期:2020-07-16,
收稿日期:2020-02-17,
修回日期:2020-06-16,
录用日期:2020-06-22
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Nanoparticle meta-grid for enhanced light extraction from light-emitting devices[J]. LSA, 2020,9(4):1197-1207.
Sikdar, D., Pendry, J. B. & Kornyshev, A. A. Nanoparticle meta-grid for enhanced light extraction from light-emitting devices. Light: Science & Applications, 9, 1197-1207 (2020).
Nanoparticle meta-grid for enhanced light extraction from light-emitting devices[J]. LSA, 2020,9(4):1197-1207. DOI: 10.1038/s41377-020-00357-w.
Sikdar, D., Pendry, J. B. & Kornyshev, A. A. Nanoparticle meta-grid for enhanced light extraction from light-emitting devices. Light: Science & Applications, 9, 1197-1207 (2020). DOI: 10.1038/s41377-020-00357-w.
Based on a developed theory
we show that introducing a meta-grid of sub-wavelength-sized plasmonic nanoparticles (NPs) into existing semiconductor light-emitting-devices (LEDs) can lead to enhanced transmission of light across the LED-chip/encapsulant interface. This results from destructive interference between light reflected from the chip/encapsulant interface and light reflected by the NP meta-grid
which conspicuously increase the efficiency of light extraction from LEDs. The "meta-grid"
should be inserted on top of a conventional LED chip within its usual encapsulating packaging. As described by the theory
the nanoparticle composition
size
interparticle spacing
and distance from the LED-chip surface can be tailored to facilitate maximal transmission of light emitted from the chip into its encapsulating layer by reducing the Fresnel loss. The analysis shows that transmission across a typical LED-chip/encapsulant interface at the peak emission wavelength can be boosted up to ~99%
which is otherwise mere ~84% at normal incidence. The scheme could provide improved transmission within the photon escape cone over the entire emission spectrum of an LED. This would benefit energy saving
in addition to increasing the lifetime of LEDs by reducing heating. Potentially
the scheme will be easy to implement and adopt into existing semiconductor-device technologies
and it can be used separately or in conjunction with other methods for mitigating the critical angle loss in LEDs.
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