Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Matthias Blaicher; Muhammad Rodlin Billah; Juned Kemal; Tobias Hoose; Pablo Marin-Palomo; Andreas Hofmann; Yasar Kutuvantavida; Clemens Kieninger; Philipp-Immanuel Dietrich; Matthias Lauermann; Stefan Wolf; Ute Troppenz; Martin Moehrle; Florian Merget; Sebastian Skacel; Jeremy Witzens; Sebastian Randel; Wolfgang Freude; Christian Koos

doi:10.1038/s41377-020-0272-5

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Original Articles

- Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
- Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
- LSA 2020年9卷第3期页码：719-729
- Affiliations：
  
  1.Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstraße 5, 76131 Karlsruhe, Germany
  2.Institute for Microstructure Technology (IMT), KIT, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
  3.Institute for Automation and Applied Informatics (IAI), KIT, Hermann-von-Helmholtz-Platz 1, 76344 EggensteinLeopoldshafen, Germany
  4.Vanguard Automation GmbH, Gablonzer Straße 10, 76185 Karlsruhe, Germany
  5.Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute (HHI), Einsteinufer 37, 10587 Berlin, Germany
  6.Institute of Integrated Photonics (IPH), RWTH Aachen, Sommerfeldstraße 18/24, 52074 Aachen, Germany
- Author bio：
  
  Christian Koos (christian.koos@kit.edu)
- Funds：
- DOI：10.1038/s41377-020-0272-5
  中图分类号：
- 纸质出版日期：2020，
  
  网络出版日期：2020-04-27，
  
  收稿日期：2019-08-23，
  
  修回日期：2020-02-09，
  
  录用日期：2020-02-23
- Accepted：
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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography[J]. LSA, 2020,9(3):719-729.

Matthias, B. et al. Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography. Light: Science & Applications, 9, 719-729 (2020).
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography[J]. LSA, 2020,9(3):719-729. DOI： 10.1038/s41377-020-0272-5.

Matthias, B. et al. Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography. Light: Science & Applications, 9, 719-729 (2020). DOI： 10.1038/s41377-020-0272-5.

摘要

Abstract

Three-dimensional (3D) nano-printing of freeform optical waveguides

also referred to as photonic wire bonding

allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage

the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips

thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However

while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments

it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper

we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment

we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter

operating at a net data rate of 732.7 Gbit/s – a record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips

we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB

and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

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references

Sibson, P. et al. Integrated silicon photonics for high-speed quantum key distribution.Optica4, 172–177 (2017)..

Nagatsuma, T., Ducournau, G.&Renaud, C. C. Advances in terahertz communications accelerated by photonics.Nat. Photonics10, 371–379 (2016)..

Harter, T. et al. Wireless multi-subcarrier THz communications using mixing in a photoconductor for coherent reception. inProceedings of 2017 IEEE Photonics Conference. (IEEE, Orlando, 2017).

Trocha, P. et al. Ultrafast optical ranging using microresonator soliton frequency combs.Science359, 887–891 (2018)..

Wang, J. W. et al. Multidimensional quantum entanglement with large-scale integrated optics.Science360, 285–291 (2018)..

Münzberg, J. et al. Superconducting nanowire single-photon detector implemented in a 2D photonic crystal cavity.Optica5, 658–665 (2018)..

Hatori, N. et al. A hybrid integrated light source on a silicon platform using a trident spot-size converter.J. Lightwave Technol.32, 1329–1336 (2014)..

Snyder, B., Corbett, B.&O'Brien, P. Hybrid integration of the wavelength-tunable laser with a silicon photonic integrated circuit.J. Lightwave Technol.31, 3934–3942 (2013)..

O'Brien, P. et al. inSilicon Photonics Ⅲ: Systems and Applications(eds Pavesi, L.&Lockwood, D. J.) 217–236 (Springer, Berlin, 2016).

Carroll, L. et al. Photonic packaging: transforming silicon photonic integrated circuits into photonic devices.Appl. Sci.6, 426 (2016)..

van der Tol, J. J. G. M. et al. InP-based photonic circuits: comparison of monolithic integration techniques.Prog. Quantum Electron.34, 135–172 (2010)..

Atabaki, A. H. et al. Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip.Nature556, 349–354 (2018)..

Mordor Intelligence.Global Hybrid Photonic Integrated Circuit Market - Analysis, Growth, Trends and Forecast 2018-2023. (Mordor Intelligence, 2018).

Malinauskas, M. et al. Ultrafast laser processing of materials: from science to industry.Light. Sci. Appl.5, e16133 (2016)..

Lindenmann, N. et al. Connecting silicon photonic circuits to multicore fibers by photonic wire bonding.J. Lightwave Technol.33, 755–760 (2015)..

Lindenmann, N. et al. Photonic wire bonding: a novel concept for chip-scale interconnects.Opt. Express20, 17667–17677 (2012)..

Billah, M. R. et al. Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding.Optica5, 876–883 (2018)..

Billah, M. R. et al. 8-channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. inProc of 2017 Optical Fiber Communications Conference and Exhibition. (IEEE, Los Angeles, 2017).

Billah, M. R. et al. Four-channel 784 Gbit/s transmitter module enabled by photonic wire bonding and silicon-organic hybrid modulators. inProc 2017 European Conference on Optical Communication (ECOC). (IEEE, Gothenburg, 2017).

Moehrle, M. et al. Ultra-low threshold 1490 nm surface-emitting BH-DFB laser diode with integrated monitor photodiode. inProc. 22nd International Conference on Indium Phosphide and Related Materials (IPRM). (IEEE, Kagawa, 2010).

Blaicher, M. et al. 3D-printed ultra-broadband highly efficient out-of-plane coupler for photonic integrated circuits. Conference on Lasers and Electro-Optics.Opt. Soc. Am. (2018).https://www.osapublishing.org/abstract.cfm?URI=CLEO_SI-2018-STh1A.1https://www.osapublishing.org/abstract.cfm?URI=CLEO_SI-2018-STh1A.1..

Telcordia. GR-468-CORE: Reliability assurance for optoelectronic devices. (2004).https://telecom-info.telcordia.com/ido/AUX/GR_468_TOC.i02.pdfhttps://telecom-info.telcordia.com/ido/AUX/GR_468_TOC.i02.pdf.

Moscoso-Mártir, A. et al. Silicon photonics transmitter with SOA and semiconductor mode-locked laser.Sci. Rep.7, 13857 (2017)..

Chang, F., Onohara, K.&Mizuochi, T. Forward error correction for 100 G transport networks.IEEE Commun. Magazine48, S48–S55 (2010)..

IEEE.802.3cn-2019 - IEEE Standard for Ethernet - Amendment 4: Physical layers and management parameters for 50 Gb/s, 200 Gb/s, and 400 Gb/s operation over single-mode fiber(IEEE, 2019).

CWDM8 MSA Group. 400 G CWDM8 MSA 2 km optical interface technical specifications revision 1.0. (2017).https://www.cwdm8-msa.org/media/400G-CWDM8-2km-Optical-Interface-Technical-Specifications-r1.0.pdfhttps://www.cwdm8-msa.org/media/400G-CWDM8-2km-Optical-Interface-Technical-Specifications-r1.0.pdf.

Wolf, S. et al. Silicon-organic hybrid (SOH) mach-zehnder modulators for 100 Gbit/s on-off keying.Sci. Rep.8, 2598 (2018)..

Zwickel, H. et al. Silicon-organic hybrid (SOH) modulators for intensity-modulation/direct-detection links with line rates of up to 120 Gbit/s.Opt. Express25, 23784–23800 (2017)..

Koos, C. et al. Silicon-organic hybrid (SOH) and plasmonic-organic hybrid (POH) integration.J. Lightwave Technol.34, 256–268 (2016)..

Kieninger, C. et al. Ultra-high electro-optic activity demonstrated in a silicon-organic hybrid modulator.Optica5, 739–748 (2018)..

Absil, P. P. et al. Imec iSiPP25G silicon photonics: a robust CMOS-based photonics technology platform.in Proc SPIE 9367, Silicon Photonics X.(SPIE, San Francisco, 2015).

Lauermann, M. et al. Low-power silicon-organic hybrid (SOH) modulators for advanced modulation formats.Opt. Express22, 29927–29936 (2014)..

International Telecommunication Union - ITU-T. Forward error correction for high bit-rate DWDM submarine systems. ITU-TG.975.1, (2005).https://www.itu.int/rec/T-REC-G.975.1-200402-I/enhttps://www.itu.int/rec/T-REC-G.975.1-200402-I/en.

Andriolli, N. et al. InP monolithically integrated coherent transmitter.Opt. Express23, 10741–10746 (2015)..

Lange, S. et al. 100 GBd intensity modulation and direct detection with an InP-based monolithic DFB laser mach–zehnder modulator.J. Lightwave Technol.36, 97–102 (2018)..

Jonušauskas, L. et al. Mesoscale laser 3D printing.Opt. Express27, 15205–15221 (2019)..

Dottermusch, S. et al. Exposure-dependent refractive index of Nanoscribe IP-Dip photoresist layers.Opt. Lett.44, 29–32 (2018)..

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