1.Key Laboratory of Radar Imaging and Microwave Photonics, Ministry of Education, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China
2.Litin Technology, Xuzhou, Jiangsu, China
3.Department of Engineering, University of Cambridge, 9 JJ Thomson Avenue, Cambridge, CB3 0FA, UK
4.College of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China
5.Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA, USA
Qixiang Cheng (qc223@cam.ac.uk)
Yeshaiahu Fainman (fainman@ucsd.edu)
Shilong Pan (pans@nuaa.edu.cn)
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Ang Li, Chunhui Yao, Junfei Xia, 等. Advances in cost-effective integrated spectrometers[J]. Light: Science & Applications, 2022,11(7):1379-1396.
Li, A. et al. Advances in cost-effective integrated spectrometers. Light: Science & Applications, 11, 1379-1396 (2022).
Ang Li, Chunhui Yao, Junfei Xia, 等. Advances in cost-effective integrated spectrometers[J]. Light: Science & Applications, 2022,11(7):1379-1396. DOI: 10.1038/s41377-022-00853-1.
Li, A. et al. Advances in cost-effective integrated spectrometers. Light: Science & Applications, 11, 1379-1396 (2022). DOI: 10.1038/s41377-022-00853-1.
The proliferation of Internet-of-Things has promoted a wide variety of emerging applications that require compact, lightweight, and low-cost optical spectrometers. While substantial progresses have been made in the miniaturization of spectrometers, most of them are with a major focus on the technical side but tend to feature a lower technology readiness level for manufacturability. More importantly, in spite of the advancement in miniaturized spectrometers, their performance and the metrics of real-life applications have seldomly been connected but are highly important. This review paper shows the market trend for chip-scale spectrometers and analyzes the key metrics that are required to adopt miniaturized spectrometers in real-life applications. Recent progress addressing the challenges of miniaturization of spectrometers is summarized, paying a special attention to the CMOS-compatible fabrication platform that shows a clear pathway to massive production. Insights for ways forward are also presented.
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