Observation of mechanical bound states in the continuum in an optomechanical microresonator

Yue Yu; Xiang Xi; Xiankai Sun

doi:10.1038/s41377-022-00971-w

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Observation of mechanical bound states in the continuum in an optomechanical microresonator

Original Articles

- Observation of mechanical bound states in the continuum in an optomechanical microresonator
- Observation of mechanical bound states in the continuum in an optomechanical microresonator
- LSA 2022年11卷第12期页码：2931-2938
- Affiliations：
  
  Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong SAR, China
- Author bio：
  
  Xiankai Sun (xksun@cuhk.edu.hk)
- Funds：
- DOI：10.1038/s41377-022-00971-w
  中图分类号：
- 纸质出版日期：2022-12-31，
  
  网络出版日期：2022-11-18，
  
  收稿日期：2022-04-08，
  
  修回日期：2022-08-26，
  
  录用日期：2022-08-28
- Accepted：
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Observation of mechanical bound states in the continuum in an optomechanical microresonator[J]. LSA, 2022,11(12):2931-2938.

Yu, Y., Xi, X. & Sun, X. K. Observation of mechanical bound states in the continuum in an optomechanical microresonator. Light: Science & Applications, 11, 2931-2938 (2022).
Observation of mechanical bound states in the continuum in an optomechanical microresonator[J]. LSA, 2022,11(12):2931-2938. DOI： 10.1038/s41377-022-00971-w.

Yu, Y., Xi, X. & Sun, X. K. Observation of mechanical bound states in the continuum in an optomechanical microresonator. Light: Science & Applications, 11, 2931-2938 (2022). DOI： 10.1038/s41377-022-00971-w.

摘要

Abstract

Bound states in the continuum (BICs) are a type of waves that are perfectly confined in the continuous spectrum of radiating waves without interaction with them. Here

we fabricated

with CMOS-compatible processes on a silicon chip

a wheel-shaped optomechanical microresonator

in which we experimentally observed the BIC in the micromechanical domain. The BIC results from destructive interference between two dissipative mechanical modes of the microresonator under broken azimuthal symmetry. Such BICs can be obtained from devices with large and robust supporting structures with variable sizes

which substantially reduces fabrication difficulty and allows for versatile application environments. Our results open a new way of phonon trapping in micromechanical structures with dissipation channels

and produce long phonon lifetimes that are desired in many mechanical applications such as mechanical oscillators

sensors

and quantum information processors.

关键词

Keywords

references

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